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YN1610 silicon wafer laser cutting machine

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Weifang Yunneng CNC Equipments Co., Ltd.Multispecialty supplier11 yrsCN

Key attributes

Industry-specific attributes

Laser Type
CO2

Cutting Speed
0-30000mm/min

Cooling Mode
WATER COOLING

Other attributes

Applicable Material
Acrylic, Leather, MDF, Paper, Plastic, Plexiglax, Plywood, Rubber, Wood

Condition
New

Cutting Area
1600*1000mm

Place of Origin
China

Application
LASER CUTTING

Graphic Format Supported
AI, BMP, Dst, Dwg, DXF, DXP, LAS, PLT

Cutting Thickness
Depends

CNC or Not
Yes

Control Software
Ruida

Brand Name
Yunneng

Applicable Material
Crytal

Certification
ce

After-sales Service Provided
Engineers available to service machinery overseas

Type
silicon wafer laser cutting machine

Laser tube type
co2 glass tube silicon wafer laser cutting machine

Positioning Accuracy
0.01mm silicon wafer laser cutting machine

Color
according to customers for silicon wafer laser cutting machine

Working area
1600*1000mm on silicon wafer laser cutting machine

Laser tube power
60w to 180w on silicon wafer laser cutting machine

Packaging and delivery

Packaging Details
plywood case to protect silicon wafer laser cutting machine well

Port
Qingdao

Supply Ability

Supply Ability
10 Set/Sets per Day silicon wafer laser cutting machine

Know your supplier

Multispecialty supplier11 yrsLocated in CN
Services
Quality control

Product descriptions from the supplier

1 - 2 sets
$8,000.00
>= 3 sets
$2,000.00

Variations

Total options:

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